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Sunday, 19 February 2012

Application-focused Gallium Nitride (GaN) Transistors Textbook

Feb 14, 2012 5:14 PM

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Efficient Power Conversion Corporation announces the publication of a textbook designed to provide power system design engineers basic technical and application-focused information on how to design more efficient power conversion systems using gallium nitride-based transistors.

"This book will help designers to understand the exceptional benefits of GaN technology and the intricacies of working with GaN transistors in power conversion systems. It will set the stage for a new era in power electronics applications that surpass everything that came before it," noted Sam Davis, Editor-in-Chief, Power Electronics Technology magazine.

This practical guide provides guidance on the use of GaN transistors in widely used power electronics applications, ranging from buck converters to Power over Ethernet. Also included are discussions on fundamental power engineering subjects such as; performance characteristics of GaN transistors, layout considerations for GaN circuits, paralleling GaN transistors and driver IC requirements for GaN transistors. The final chapters address GaN device reliability, their exceptional radiation-resistant characteristics as well as their future in power electronics.

According to Alex Lidow, Efficient Power Conversion CEO and co-author of this book, "Gallium nitride transistors provide a long-awaited displacement technology for MOSFETs, and much has been learned over the past several years about how to apply this new technology. In addition to increasing the efficiency of today's power conversion systems, GaN transistors open up new applications such as RF envelope tracking and wireless power transmission that are much needed to keep pace with the ever-expanding communications industry and battery operated products. These new applications are enabled by the high frequency switching capability combined with the high voltage and high power capabilities of gallium nitride FETs."

"GaN Transistors for Efficient Power Conversion" is available for $39.95 and can be purchased from the EPC website (www.epc-co.com), Digi-Key (www.digikey.com) or Amazon (www.amazon.com).

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Miniature Motor Driver Modules

Feb 14, 2012 5:05 PM

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STMicroelectronics has added two miniature motor drivers to its range of SLLIMM (Small Low-Loss Intelligent Molded Modules), which will enable domestic appliances to offer better energy ratings.

ST's new SLLIMM nano family extends the portfolio of SLIMM intelligent power modules for appliance motor drivers in a single module that connect directly between the central microcontroller and the motor. Compared to a conventional driver, which typically requires more than 30 individual components, ST's modular solution reduces costs by simplifying design and significantly reducing component count while saving space, improving reliability and lowering electromagnetic emissions (EMI). The modules are also ideal for small built-in motor applications where assembly space is limited.

Two variants are available; the STGIPN3H60 and STGIPN3H60A. They are each housed in a 29.15 x 12.45mm package with 26 leads, making them ST's smallest such devices to date. Inside each module is a complete three-phase half bridge including high-voltage gate drivers and IGBT power switches, plus freewheeling diodes and bootstrap diodes. The bootstrap diodes supply high-voltage circuitry on the motor side as the driver module is starting up. Integrating it in the module delivers an additional saving in external components, and is achieved using a patented technique unique to ST.

The STGIPN3H60A provides basic motor-drive capabilities for price-sensitive applications. Extra features in the STGIPN3H60 include an uncommitted op-amp, which engineers can use to feed back the sensed motor current to the microcontroller in a closed-loop, Field-Oriented Control (FOC) system. There is also a comparator for use in over-temperature or over-current shutdown. The STGIPN3H60 also has a smart shutdown function capable of generating a simple fault indication or shutting the driver down safely within 200ns in an emergency.

The STGIPN3H60A and STGIPN3H60 are available now in full production in the 26-pin NDIP leaded package, priced at $5.8 for the STGIPN3H60A and $6.0 for the STGIPN3H60, for orders of 1000 pieces.

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Optical Sensor Combines Ambient Light and Proximity Sensors

Feb 8, 2012 11:08 AM

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Maxim Integrated Products Inc. introduces the MAX44000, a digital ambient-light and infrared proximity sensor that detects light like a human eye. Designed using the company's proprietary BiCMOS technology, this IC integrates three optical sensors, two ADCs, and digital functionality into a tiny 2mm x 2mm x 0.6mm package. This integration saves valuable board space while delivering optical fusion and unparalleled light-sensing performance.

The MAX44000 also consumes very low power: only 5?A when the ambient sensor is enabled, and only 7?A when both the proximity sensor and ambient light sensor are activated. This low-power usage significantly extends an application's battery life. The MAX44000 is ideal for touch-screen applications, including smart phones, portable devices, industrial sensors, and presence detection.

When a smart phone is brought up to a user's face, the touch screen must be shut off to prevent inadvertent touches that may disrupt the call. Thus a proximity sensor is crucial, so the phone can "sense" an object is within a certain distance during a call or any other preset event. Once a sensed signal is received, it is run through a DC ambient, infrared (IR) rejection front-end circuit and sent to an ADC. This process allows the MAX44000 to operate in the presence of large amounts of DC IR radiation. By using a single-pulse technique for pulsing the external IR LED, the sensor is immune to fixed-frequency external IR radiation. This immunity leads to more reliable sensor operation.

Traditional light sensors are strongly influenced by ultraviolet (UV) and IR light, which are not perceptible by the human eye. Sensing this light leads to inaccurate ambient-light readings. Maxim's BiCMOS technology enables the integration of the two photodiodes and an optical filter to reject UV and IR light. This allows the MAX44000 to replicate the optical response of the human eye in a variety of environments.

Designed for the tight space requirements of portable systems, the MAX44000 is offered in a lead-free, 2mm x 2mm x 0.6mm, 6-pin UTDFN-Opto-EP package. The part operates between -40?C to +105?C to enhance system robustness. Prices start at $1.65 (1000-up, FOB USA).

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Linear Technology Acquires Dust Networks

Feb 8, 2012 11:31 AM

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Linear Technology Corporation announced the acquisition of Dust Networks, Inc., a leading provider of low power wireless sensor network (WSN) technology. The acquisition of Dust Networks, based in Hayward, CA, will enable Linear to offer a complete high performance wireless sensor networking solution. Dust Networks' low power radio and software technology complements Linear's strengths in industrial instrumentation, power management and energy harvesting technology.

Dust Networks' proven, low power wireless sensor network technology extends Linear's product portfolio into key growth areas in industrial process control, data acquisition and energy harvesting. Dust Networks' ultralow power wireless systems complements Linear's analog and digital sensor interface ICs, and energy harvesting power management products in applications where measurement of physical parameters has traditionally been impractical or impossible.

Erik Soule, Vice President of Signal Conditioning and High Frequency products for Linear Technology, stated, "Dust Networks offers the lowest power radio technology and most complete networking software for building industrial-grade wireless sensor networks. Combined with Linear's precision low-power sensor interface products and battery-free energy harvesting technology, we can now offer the industry's highest performance remote monitoring solutions."

With the growing importance of machine-to-machine communications to enable remote data acquisition, low power wireless sensing is an emerging solution for many end-markets, including industrial process control, building automation and data center energy management.

"Smart Dust" was first conceived by Dr. Kris Pister, founder and chief technologist of Dust Networks, as a simple way to deploy intelligent wireless sensors. Dust Networks pioneered SmartMesh? networks that comprise a self-forming mesh of nodes, or "motes," which collect and relay data, and a network manager that monitors and manages network performance and sends data to the host application. This technology is now the basis for a number of seminal networking standards. The hallmark of Dust Networks' technology is that it combines low power, standards-based radio technology, time diversity, frequency diversity, and physical diversity-to assure reliability, scalability, wire-free power source flexibility, and ease-of-use. All motes in a SmartMesh network-even the routing nodes-are designed to run on batteries for years, allowing the ultimate flexibility in placing sensors exactly where they need to go with low cost "peel and stick" installations.

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Saturday, 18 February 2012

Expanded Portable Power MOSFET Portfolio

Feb 8, 2012 11:23 AM

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Alpha and Omega Semiconductor introduced the AON7418, adding to a growing portfolio of power MOSFETs in small, ultra-thin packages. The new device provides exceptionally low on-resistance that is optimized for demanding applications such as tablet PCs, eReaders, notebooks, telecom and networking.

AON7418 is a 30V N-channel device implemented on AOS' proprietary AlphaMOS technology, with a 1.7 m? RDS(ON) at 10V, QG of 23 nC, 50A ID and 25?C. AlphaMOS technology improves RDS(ON) by 40% over the previous generation. The device provides power designers the flexibility in optimizing space, performance and cost.

AON7418 is in halogen-free DFN3.3x3.3 package and is 100% UIS and RG tested. It is immediately available in production quantities with a lead-time of 12 weeks. The unit price for 1,000 pieces is $0.70.

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GreenChip Low-Power SMPS Controllers

Feb 14, 2012 5:09 PM

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The NXP TEA172x family is a series of small, low-cost module SMPS controller ICs that operate directly from the rectified universal mains input and are tailored for low-power applications up to 5, 8, or 11 W. Each device is equipped with a high-voltage power MOSFET switch (700 V) and is optimized for flyback, buck, and buck-boost converter topologies. The result is high efficiency over the entire load range. Power consumption in the no-load condition below 10 mW at 5 W, which exceeds the EPA 2.0 rating and the 5-star rating defined by EnergyStar.

The architecture includes several features that serve to reduce total component count, minimize the design footprint, and lower overall cost. Primary side-sensing, which eliminates the need for a power-consuming opto-coupler. The architecture meets EMI specification without an external Y-cap, and integrated active HV start-up eliminates resistor bleeder circuitry. Fewer than 30 external components are required for a complete bill of materials. Advanced control modes enable very high average efficiency (above 77%) over the entire load range, and compliance with USB 1.1 and 1.2 makes them well suited for use in mobile phone charger applications. Switching losses are kept low with a burst frequency of 420 Hz, and a variety of protection features ensure reliable operation under a wide range of conditions.

Design tools for the TEA172x family include a range of demo boards, extensive application notes, and an online calculator that helps predict real-world performance. the entire load range.

The TEA1721 supports operation up to 5 W and is ideally suited for use in mobile USB chargers, major home appliances, and industrial systems. The TEA1722, in development, supports applications up to 8 W and is intended for smart phones and personal consumer products. The TEA1723 runs at up to 11 W and targets tablet PCs, e-readers, and set-top boxes (STBs). All three TEA172x devices have the same feature set but use a different power MOSFET, tailored for operation up to 5, 8, or 11 W, respectively.

The TEA172x architecture provides a circuit for start-up directly from the rectified mains voltage without any external bleeder circuits. The converter operates as a regulated voltage source from no-load up to the maximum output current and operates as a current source that delivers the maximum current over a broad output voltage range.

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Semiconductor Industry Revenue to Endure Slow Growth in 2012

Feb 8, 2012 11:34 AM

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With global economic prospects remaining uncertain and semiconductor inventory not moving quickly enough to stimulate new production, the worldwide chip market is expected to suffer a slow year in 2012 marked by sluggish growth.

Semiconductor industry revenue in 2012 is expected to reach $323.2 billion, up a slight 3.3 percent from last year?s revenue of $312.8 billion, according to an IHS iSuppli Global Manufacturing Market Tracker report from information and analysis provider IHS,

While expansion this year is expected to be better than the paltry 1.25 percent increase of 2011, the overall picture could brighten considerably if the United States and the rest of the world recover in 2013. Under such a scenario, growth from 2013 to 2015 will average between a more encouraging 6.6 to 7.9 percent, as shown in the figure below, with total semiconductor revenue by 2015 rising to some $397.7 billion.

"Much of the weak performance in both 2011 and this year can be attributed to external circumstances over which the semiconductor industry has no control?the ambiguous state of the global economy, along with assorted troubles in the world?s major markets of the United States, Europe, Japan and China," said Len Jelinek, director and chief analyst of semiconductor manufacturing research at IHS. "And because the world economy is not in a strong-enough position to drive growth, the semiconductor business is coming under pressure."

Although consumer spending lowered the level of inventory of electronic devices and other items incorporating semiconductors during the 2011 holiday season, the reduction was insufficient to re-energize chip demand to replenish stockpiles. Worse, a deliberate decrease in manufacturing run rates by companies in the third quarter of 2011 proved unable to bring inventory down to levels that would have fired up additional orders and increased factory run rates. As a result, semiconductor demand for manufacturers will remain depressed until the second quarter of 2012.

Such developments will have a ripple effect throughout the industry. For instance, because factory utilization will not recover until the middle of 2012, the integrated device manufacturers (IDM) that both design and manufacture semiconductors in-house will experience even greater stress to simply maintain the viability of underperforming factories. And with current manufacturing capacity deemed acceptable for meeting demand, most capital expenditures to boost efficiency within the industry likely will be pushed out to 2013.

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Sunday, 19 February 2012